? Compatible with 6-12 inch multi-specs wafers
? Self-cleaning brush head
? Independent flipping module, automatic flipping and cleaning of both sides of the wafer
? Accurate alignment of multi-specs wafers
? Excellent cleaning results
? A variety of safety tests(avoiding Debris producing)
Applicable Process | Mask Clean |
Applicable Size | 4&6 inch,6&8 inch |
Loadport type | Open Cassette |
Chemicals | ACE/NMP/EKC/IPA |
Particle | ≤30ea @0.2μm |
Frangementation Rate | ≤0.1‰ |
企業(yè)網(wǎng)站
COPYRIGHT北京華林嘉業(yè)科技有限公司 版權(quán)所有 京ICP備09080401號