? Compatible with a wide range of wafer specs
? Self-cleaning brush head
? Optional configure(wet in and dry out or dry in and out)
? Independent flipping module, automatic flipping and cleaning of both sides of the wafer
? Flexible chambers( 2/4/6/8 )configuring
? Excellent cleaning results
? A variety of safety tests(avoiding Debris producing)
Applicable Process | Wafer Clean,Mask Clean |
Applicable Size | 4&6 inch,6&8 inch,8&12 inch |
Loadport type | Open Cassette,FOUP,SMIF |
Chemicals | DIW |
Particle | ≤10ea @0.3μm , ≤500ea @0.2μm |
Frangementation Rate | ≤0.1‰ |
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