Fully-auto Monolithic Cleaning Machine adopts a multi-layer ca-vity structure, with a rotating brush head, two fluids, megasound and a variety of chemical liquids, which can effectively remove p-hysical particles and metal ion residues on the wafer, and is mai-nly used for the final cleaning of wafer manufacturing, post-CMP cleaning,pre-diffusion cleaning, post-etching cleaning, standard RCA, PR removal cleaning,pre- and post-coating cleaning, etc.
? Compatible with a wide range of wafer specs
? Self-cleaning brush head
? Achievable 4 cavity layers and the recovery of 3 kinds of chemical solutions
? Independent flipping module, automatic flipping and cleaning of both sides of the wafer
? On-line liquid dispensing function
? Flexible chambers( 2/4/6/8 ) configuring
? Excellent cleaning results
? A variety of safety tests(avoiding Debris producing)
Applicable Process | Wafer Clean,Etch,PR Strip |
Applicable Size | 4&6 inch,6&8 inch,8&12 inch |
Loadport type | Open Cassette,FOUP,SMIF,EFEM |
Chemicals | DIO3/SC1/SC2/DHF/HNO3/NMP/IPA |
Particle | ≤30ea @0.2μm |
Residue Of Metal Ions | ≤1E10 atoms/cm2 |
Frangementation Rate | ≤0.1‰ |
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