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The ultra-thin Marangoni drying system is designed for ultra-thin wafers (110μm-1400μm) made of materials such as Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), and Indium Phosphide (InP). It is compatible with 4/6/8/12-inch wafer sizes and is suitable for advanced packaging, MEMS sensors, and other fields that require stringent control over  wafer thickness and surface integrity. Leveraging the high-precision Marangoni effect, the system uses nitrogen pressure to form a nanoscale uniform film of IPA on the water surface. It combines ultra-low stress lifting and micro-pulse drainage dual-mode drying to eliminate the risk of deformation in ultra-thin wafers. The equipment employs a contact-based top and bottom transfer mechanism to ensure zero damage during the handling and drying processes, while also preventing contamination caused by the separation of wafers from their cassettes.